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BGA encapsulation memory
BGA encapsulation of I/O terminals in the form of a circular or columnar joints according to the array
distribution under the encapsulation, BGA technology has the advantage of the I/O pin number although
increased, but the pin spacing is not actually increased, so as to improve the assembly yield; Although it
increases power consumption, BGA chip welding method with controllable collapse, thus can improve the
electric performance; Thickness and weight of packaging technology has decreased than before; Reduce
parasitic parameters, signal transmission delay is small, use frequency is greatly increased; Assembly can
be coplanar welding, and high reliability.