BGA encapsulation memory

BGA encapsulation of I/O terminals in the form of a circular or columnar joints according to the array

distribution under the encapsulation, BGA technology has the advantage of the I/O pin number although

increased, but the pin spacing is not actually increased, so as to improve the assembly yield; Although it

increases power consumption, BGA chip welding method with controllable collapse, thus can improve the

electric performance; Thickness and weight of packaging technology has decreased than before; Reduce

parasitic parameters, signal transmission delay is small, use frequency is greatly increased; Assembly can

be coplanar welding, and high reliability.