Copyright © 2014 www.lybga.com. All Rights Reserved. LiYang (LY) Welding Equipment Co., Ltd.
News
Contact
Industry News
The main advantages of the PBGA package
The main advantages of the PBGA package:
1.The PBGA can be fabricated using existing assembly technology and raw materials, relatively low cost of
the whole package.
2.Compared with QFP devices, not susceptible to mechanical damage.
3.Electronic and can be applied to the mass assembly.
Hits: 【Printing】
Previous:JCET:The Best is Yet to Come Next:BGA encapsulation memory