How do the treatment should be produced in CAM BGA?

How do the treatment should be produced in CAM BGA?

Making the outer lines at BGA:

At present exist and BGA, and less than the distance to the design process of electric, electrical

distance, customer information without pretreatment to the comprehensive understanding of BGA

specifications, customers in the design of the pad size and array BGA hole size, hole to BGA solder

pads, copper thickness is 1 to 1.5 ounces of PCB board, in addition to specific customers according

to their acceptance to seek to do the corresponding compensation, the remaining customers if

production using mask etch process when the general compensation 2mil, the process of compensation

for the 2.5mil specifications 31.5mil BGA the graph processing. When the client BGA vias 8.5mil hole

of the centered, can use the following methods:

Can refer to BGA specifications, design welding disk size corresponding to the customer designed

BGA position do a standard BGA array, again with its for baseline correction of BGA and BGA vias

for forehand, taken to and do not take a backup of your level of contrast examination a shoot is

before and after the effect, if BGA Solder disc before and after the deviation is larger, can not be used,

only to shoot a BGA hole location.

BGA solder production:

1, BGA surface sticking resistance welding window: and the solder resist optimization value as the

scope of unilateral fenestration for 1.25~3mil, resistance welding distance lines (or pad holes) larger

than the spacing equal to 1.5mil;

2, BGA template layer and backing layer hole processing:

Manufacture 2mm layer: in line layer BGA pad copy layer to another layer of 2mm and the range of

2mm Square body, 2mm not blank, gap (such as customer requirements to BGA character frame jack,

BGA character in a box for 2mm do the same), 2mm entity to and the layer BGA character character

frame compare, both from the larger is 2mm layer.

II Jack layer (JOB.bga): to hole layer touch 2mm layer (with panel to choose actions, reference selection

function reference 2mm layer), the parameter mode to elect touch, BGA 2mm range of domestic

demand to plug the hole copy to Jack layer, and named for: JOB.bga (note, such as customer

requirements of BGA test hole not to deal with Jack, will test hole selected, BGA test hole features:

full window or single window on both sides of the resistance welding).

The copy of jack for another layer pad layer (JOB.sdb).

According to the BGA file to adjust the aperture and hole hole layer plate layeraperture.

The corresponding BGA hole blocking layer, character layer processing:

The need to plug the place, plugging holes on both sides without blocking point layer;

The character layer relative plug hole hole allows the oil inlet hole.

After the completion of the above steps, BGA cam sheet making is complete, this is just the BGA cam veneer

production, in fact, as a result of the rapid changes of electronic information products, the fierce competition

in the PCB industry, a plug hole BGA production rules is often in the replacement, and constantly have new

breakthrough.This time the breakthrough, the product and the last step, more to meet changing market demands.

 We look forward to more advantages about BGA technology or otherbaked jack.