BGA welding traditional method and the latest method

BGA welding traditional method and the latest method

With the progress of science and technology, industrial production but also the birth of a new way of more

and more, although manual operation has its irreplaceable. However, new semi-automatic or automatic

machine operation will still to replace most of the manual work, today we introduced BGA welding.

To success of BGA welding, we must first understand its characteristics: BGA IC is belongs to a kind of large

scale integrated circuit, is mainly for the small size of the electronic products development, because of its

tube feet in IC bottom, although can save most of the space but because of its tube feet very intensive.

Therefore, it is very easy to cause the weld. Sealing. The failure rate is fairly high. Here is a detailed

introduction to his welding method:

1.Location: remember IC's direction in the main edition, remembering its place. If there is no main version of

the IC BGA position we need to put its position on the main edition.

2.Demolition of the BGA Solder: first in BGA IC around Garzon, perfume, slightly thick, if soldering paste need

air gun for BGA IC preheat and soldering paste painted on the IC around soldering paste will have their own

into the bottom of the IC. Then will host fixed, wind temperature gun transferred to 280~~300 degrees air

volume in the 4~~6 with big guns head (lookout gun to paper blowing, 2 ~ 3 seconds paste the for 280

degrees or so) from BGAIC 1.5 centimeters blowing, air gun or stop around IC rotation, do not hurry, be IC

with outflow flux when from time to time with a pair of tweezers light poke, IC activities and then blowing

about 2 seconds with tweezers interlinear IC decisive filed, don't hesitate, action to be fast. To this, IC BGA

removal of the welding.

3.Cleaning pad and IC: Iron and then pad a drag, the pads on the tin was towed away, trying to smooth.

Then wash with the agent, the main version, clean, paint; IC with double-sided adhesive on the positioning

board, with iron ball towed away, so that it is flat and smooth. Clean the IC again.

4.BGA tin and welding: BGA tin is the most critical one. Beginners can use the positioning version, IC stick

on the above. To find the corresponding steel mesh, the online hole alignment IC foot must be aligned!!.

Fixed, and then the tin paste scraper reprint uniformly scrape, make each hole with the same amount of

solder paste, scraping clean the surface of the steel network, with a pair of tweezers hold two diagonal

steel net with air gun to the same temperature from the steel net 3~~4 cm blowing, at this time also

don't be impatient, melt the solder paste flux to be. Evaporation part will air gun slightly downward,

you can see the BGA IC legs began to melt, at million not can be mobile tweezers, wait until the entire

melt and then blowing about 2 seconds to close the gun. The solder ball after cooling to loosen the

tweezers. Tweezers will be sidelined feet down by the IC from the steel line shedding and the IC feet

washed, air gun to blow a Oh, for is to prevent the tube foot misplacement when tin can automatically

reset. Clean the IC brush with the brush after cooling.. Welded plate coated with a little flux, the IC to

find a good direction, position alignment, blowing in the same temperature welding, does not use

tweezers to tap until it can automatic homing and then blow after 2 seconds to close the gun. After

the standby version of the cooling can try machine.