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BGA Rework Recommendations

BGA Rework Recommendations


Removal and replacement of BGA packages on printedcircuit boards is fairly straightforward. 

However, reat-tachment or touch-up of BGA packages that have alreadybeen soldered to the

board is not practical in most cases.


Three important criteria should be considered whenchoosing a rework system:

•Minimize the change in temperature across thesolder joint array to promote good solder joint

forma-tion, minimize intermetallic growth, improvesolderability and minimize component warpage

•Minimize die temperature to prevent die delamina-tion and wire bond failure

•Minimize board temperature adjacent to the reworksite to reduce intermetallic growth, prevent

second-ary reflow, and prevent possible component delamination.


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