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BGA Rework Recommendations
BGA Rework Recommendations
Removal and replacement of BGA packages on printedcircuit boards is fairly straightforward.
However, reat-tachment or touch-up of BGA packages that have alreadybeen soldered to the
board is not practical in most cases.
Three important criteria should be considered whenchoosing a rework system:
•Minimize the change in temperature across thesolder joint array to promote good solder joint
forma-tion, minimize intermetallic growth, improvesolderability and minimize component warpage
•Minimize die temperature to prevent die delamina-tion and wire bond failure
•Minimize board temperature adjacent to the reworksite to reduce intermetallic growth, prevent
second-ary reflow, and prevent possible component delamination.