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Disassembly, welding technique of patch type components
Disassembly, welding technique of patch type components
SMD components, removing welding should choose 200 to 280 DEG C temperature controlled soldering iron tip.
SMD resistor, capacitor substrate mostly adopts ceramic material, this material by the collision, easily broken.
Therefore in the demolition, welding should master the temperature, preheating, touch and other skills.
Temperature control is the welding temperature should be controlled at 200 ~ 250 degrees celsius.
Preheat the elements that will be welded to the environment at 100 degrees Celsius for 1 to 2 minutes,
to prevent the sudden expansion of the components of the heating damage. Touch operation refers to
the iron head should first of the printed circuit board solder or conduction heating, so as not to hit the
element. In addition to control each welding time in about 3 seconds, so that the circuit board at room
temperature and natural cooling.
The above methods and techniques are also suitable for the welding of the two and the three poles of the chip.
Patch type integrated circuit pin number, narrow spacing, hardness is small, if the improper welding temperature,
extremely easy to cause the fault of the pin solder short circuit, weld or printed circuit copper foil from printed
circuit board etc. Remove patch type integrated circuit, the thermostat iron temperature adjusted to 260 DEG C,
with the soldering iron head with solder sucker will be integrated circuit pin solder all suction, with fine pointed
forceps gently insert the at the bottom of the integrated circuit, side with a soldering iron, while with tweezers,
one by one, gently lift the IC pin, gradually and printed circuit board from the integrated circuit pin. An
integrated circuit with tweezers with iron heating parts must be carried out simultaneously, to prevent the
circuit board damage will act with undue haste. In front of the new integrated circuit to the original integrated
circuit to leave all the solder, to ensure the smooth and clean. Then the welding integrated circuit pin with fine
sandpaper clean, uniform tin, and then welding integrated circuit pin alignment of printed circuit board
corresponding solder joint, welding with handle gently pressing on the integrated circuit surface, prevent
the integrated circuit of mobile, the other hand operated electric iron dipped in solder will be set into the
circuit four angle pin and the circuit board is welded and fixed, once again check the type and direction of
integrated circuit, right after the formal welding, the iron temperature at about 250 DEG C, one hand soldering
iron to the integrated circuit pin heating, the other hand will be sent to the pin welding solder wire heating,
heating until all pin welding completed, carefully check and remove the last pin short and weld, solder joints
after natural cooling, another cleaning circuit board and solder joint with a brush dipped in alcohol, to prevent
the welding slag left. Before the repair module circuit board fault, are advised to use brush dipped in anhydrous
alcohol cleaning printed circuit board, board dust, welding slag and other debris cleared and observe of the
original circuit board whether there are weld or welding slag short circuit, and other phenomena, and early
detection of fault point and save maintenance time.