BGA Ball Grid Array (PCB)

Is the full name of BGA Ball Grid Array (PCB) Ball Grid Array structure, it is a integrated circuit using airborne plate is a kind of encapsulation method.It has: (1), the packaging area is less;(2), function more, pin number increase;(3), PCB welding can self centered, when the tin easily;(4), high reliability;(5), good performance, low overall cost.BGA PCB hole is more commonly, most customers under the BGA via design to finished product hole diameter is 8 ~ 12 mil, BGA surface to hole distance specification 31.5 mil, for example, is generally not less than 10.5 mil.Under the BGA via plug hole, BGA solder is not allowed on ink, BGA welding plate is not boring.