BGA repair procedure

1. PCB and BGA baking.(80 to 80 degrees. 12 to 24 hours. Can be adjust according to the actual situation is

doing.)

2. Installation (installation) according to the external situation.

3. The boot to check whether the machine is normal.

4. Select PCB and BGA.(curve has been tuned cases.)

5. According to the size of the PCB, the size of BGA choose temperature and nozzle.

6. The lower support needle will be dispatched to the PCB fixture minimum balance grooves.

7. Place the PCB on the fixture, move down to the bottom of the jig made to dismantle the BGA in hot plate

at the bottom of the upper part.

8. To the upper air head evenly cover off the BGA surface 2 mm - 5 mm.

9. Click start, the machine upper and lower heating.

10. Curve when the machine stop alarm, screw and remove the upper air head quickly, with vacuum suction pen

absorbs the BGA.

11. When the lights went out to take the PCB, the PCB surface coating a layer of solder paste, the PCB with blade

iron surface residual tin towing flat and clean.

12. Place the PCB on the fixture, the PCB surface coating layer of the uniform help solder paste, the BGA evenly

placed on the PCB silk reflected in quantico line.

13. The upper air head evenly cover off the BGA surface 2 mm - 5 mm.

14. Click start, the machine upper and lower heating.

15. When hot blast temperature at the upper run to paragraph 5, with a machine on the floodlight observe the

melting of solder ball, can be used to pause or stop adjustment curve.

16. When machine curve stop alarm, such as activated after the lights went out to take the PCB cooling, then test

the function is normal.

17. If empty welding, lengthen the constant temperature time of paragraph 6 of the upper.Such as tin.Shorten the

constant temperature time of paragraph 6 of the upper.

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