BGA rework station technical data

BGA rework station technical data

1.BGA：Ball Grid Array

2.BGA classification :  PBGA,  CBGA,  TBGA

3.BGA save environment : 20-25℃ ，<10％RH CSP: Chip Scale Package or BGA - chip size package
QFP: quad flat package. Package spacing: 0.3mm 0.4mm.

PBGA

(1) use: applied to consumer and communications products

(2) the relevant parameters of the welding temperature (s) time (℃) of the corresponding parameters

of the welding temperature of the corresponding welding parameters (℃)

Sn63Pb37 183 60-90 220-225 Sn62Pb36Ag2 179  220-225 Sn96.5Ag3Cu0.5 217 90-120 230-235
Solder ball spacing: 1.27 mm  1 mm   0.8 mm  0.6 mm 

Solder ball diameter : 0.76 mm   0.6 mm, 0.4 mm   0.3 mm

CBGA

Ingredients: Pb90Sn10 melting point: 302℃
Features: through the low melting point solder attached to the ceramic carrier, and then this device is

connected to the PCB through the low melting point solder, no reflow phenomenon.
Reflow soldering peak temperature: 210-225℃

TBGA

Solder ball diameter: 0.76 mm
Pitch: compared to 1.17 mm and CBGA, TBGA on ambient temperature strict control, chip when heated

due to that tension heat concentrated in the four corners of the, easy welding defects.