BGA welding and machine use

BGA welding and machine use

A. and 27X27mm size of BGA (371AB, M1531, M1543, 439TX)
   temperature setting≒ 185 ~ 190 ℃± 5℃

1.To be BGA PCB desoldering placed on the bottom heater (heating oven) for about 3 minutes or to touch

the PCB feeling slightly hot.

2.Adjust the level regulator to make the metal cup (NOZZLE) and BGA distance of about 0.5cm.

3.Step on pedal switch, the SMD-1000 heat about 1 minute and 30 seconds to start, to a blade or word play

nudge BGA edge view is loose, to determine the BGA soldering tin melted.

4.To press the Vacuum Pump control knob (Vacuum Pump Controller) press the draw will be BGA suck up

again, or roll up Level regulator (Level Adjuster) in Vacuum chuck sucked up the BGA.

B.Welding

1.The PCB has been taken under the position of BGA on residual tin removal and smoothed to clean oil

stains rosin.

2.Selection for plate placement in is taken the position of the BGA on, plate hole must be and BGA Solder

point is fixed, take proper amount of solder paste evenly on the plate.

3.Carefully remove the plate, will want to change the BGA accurately placed in the correct position.

4.To be back to the BGA PCB welding and placed on the bottom of the heater (heating oven) for about

3 minutes or to touch the PCB feeling slightly hot.

5.Adjust the level regulator to make the metal cup (NOZZLE) and BGA distance of about 0.5cm.

6.Step on the foot switch to start heating the SMD-1000 about 30 minutes 1 seconds, release the pedal

switch, turn off the bottom of the heater (oven), shake the level of the regulator.