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BGA welding and poor analysis

BGA welding and poor analysis

 

BGA welding point of short circuit (also known as adhesion):


1 solder paste printing (Guo Hou), bad patch adhesion between solder and solder paste reflow soldering

solder joints caused by short circuit.


2 patch is more than or more than 50% manual adjustment.


Solution:


1 solder paste printing by block operator strictly control the printing quality inspection.


2 adjust the patch coordinates. If there is more than 50% of the offset to the vacuum brush to absorb the

patch, the prohibition of manual adjustment.

 

BGA welding point:


1 copies of the solder paste or pad printing defects.


2 return welding temperature (curve) set improper.


Solution:


1 solder paste printing by block operator strictly control the printing quality inspection.


2 using temperature measurement board to formulate the reflow parameters of the process.

 

 


TAG:  BGA welding BGA Solder Joints reflow soldering PCB plate solder lead solder
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