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BGA welding and poor analysis
BGA welding and poor analysis
BGA welding point of short circuit (also known as adhesion):
1 solder paste printing (Guo Hou), bad patch adhesion between solder and solder paste reflow soldering
solder joints caused by short circuit.
2 patch is more than or more than 50% manual adjustment.
Solution:
1 solder paste printing by block operator strictly control the printing quality inspection.
2 adjust the patch coordinates. If there is more than 50% of the offset to the vacuum brush to absorb the
patch, the prohibition of manual adjustment.
BGA welding point:
1 copies of the solder paste or pad printing defects.
2 return welding temperature (curve) set improper.
Solution:
1 solder paste printing by block operator strictly control the printing quality inspection.
2 using temperature measurement board to formulate the reflow parameters of the process.
TAG:  BGA welding BGA Solder Joints reflow soldering PCB plate solder lead solder