How to maintain the BGA ball

How to maintain the BGA ball

BGA ball (also known as BGA solder) is an essential material.

The role of BGA Solder ball is used instead of the pin IC component packaging structure, so as to meet the

electrical interconnection and mechanical connection requirements of a connecting piece. BGA ball common

specifications (unit: mm):

0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 and 0.76, and there are some unconventional, such as: 0.889.

Each kind of specification will have corresponding BGA stencil, in repairing chip, according to the different chips,

choose appropriate BGA Solder Balls and steel net for planting ball.

BGA solder balls are directly related to the quality of planting ball success, if kept properly, will make the quality

of BGA Solder Ball variation, thus affecting quality of BGA ball. Of course, there are many aspects of the quality

of the ball, such as the use of BGA welding can effectively improve the quality of the ball.

Then, BGA solder ball maintenance need to pay attention to what?

A, using the temperature and humidity of the environment and the best conditions for the same.

B, not using BGA ball please try not to open the lid, so avoid air entering the BGA ball caused by oxidation.

C, so save field must avoid BGA ball vibration, moisture, light irradiation.

D, due to vibration, moisture, light irradiation may result in lower quality of BGA solder ball.The ball E, temporarily

without advice should be kept in the original BGA ball bottle, and the outer cover are locked.

F, the condition is 25 + 10, relative humidity 60%RH.