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Key to the success of BGA welding
Key to the success of BGA welding:
1. the temperature characteristics of lead-free solder lead solder (solder or solder paste) to understand
2. establish accurate temperature curve, master the time.
3 with the right wind nozzle. Because the principle of the hot air BGA welding is to use the wind nozzle
to the BGA chip in the inside, forming an independent return welding space, the air nozzle is very
important, the direct impact of the BGA welding quality.
4 ball planting is good or bad, manual planting the ball because the return is not very good, planting
the ball when the temperature is a little cause solder ball volume collapse does not mean that this will
affect the quality of the weld. If possible, make a return with the table. A digital timer, a temperature
controller, a cast aluminum heating plate, a shell and the cover can be.
5 flux selection. The general differential flux and temperature not to welding will evaporate, until the
reflow soldering 225 degrees when almost no soldering function. It is possible to choose a good paste.
TAG:  BGA welding solder lead solder