Copyright © 2014 www.lybga.com. All Rights Reserved. LiYang (LY) Welding Equipment Co., Ltd.
News
Contact
Industry News
Some suggestions for BGA
Some suggestions for BGA
The following tips, for reference only.
1.Remove the IC, cleaning up residual tin, tin wire (with rosin) tin tin to both flat and drag disc replacement
into the low temperature.
2.To the corresponding plate on the plate, according to the above method to repeat the operation once!
3.If back welding equipment to put it back to the IC, the operation is more simple! But if by hand to hold
back, please first on board pad heating. To be welded plate tin brighten, put on IC and aligned with the
corresponding position. (tweezers available for positioning or put the IC) by air Gunners with inclined
wind welding way to hold back to the IC (oblique blow welding operation to be have the opportunity
to further promote, with 'oblique blow welding' in the Baidu search to see)
4.If the manual welding blow back to the IC, judge between the IC and the board of solder ball is perfect
welded, with hard, sharp points of the needle, gently from IC edge props, the itinerary can only be is
0.1~0.2MM. If you can bounce back quickly from, that solder ball can weld well!
TAG:  BGA PCB SMD BGA soldering BGA rework station