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Universal embedded bead sets of BGA balls steps

Universal embedded bead sets of BGA balls steps


Prepare tools: Universal embedded bead sets, solder, solder paste, cleaning agent, flux, ceiling tin line,

oil painting brush, hexagon board hand, electric iron, cloth etc.




BGA is coated on a small amount of flux, with constant temperature soldering iron absorb solder ball,

and then temperature Luo iron heating suction line tin, tin absorption line to remove residual tin BGA pad.

(Note: the soldering temperature at 260 degrees to 300 degrees)




Will be in addition to the BGA chip with a clean cloth dipped in clean cloth to wipe clean.

(Note: BGA flux on chemical reaction will occur and produce a qualitative change, influence of parts welding)


C.Ball planting process:


1, the BGA chip on the bead table, using the six corner plate to adjust the fixed base on the BGA size, so

that the BGA chip can be flat on the ground.

2, using the brush will help paste evenly coated on the BGA surface.

3, according to the different BGA chip select suitable reballing steel mesh and solder balls and steel net fixed

in planting beads and die, adjust steel mesh and chip tin point enable completely coincident)

4, pour into the solder ball planting Taiwan shaking the steel mesh, the corresponding solder fill

5, the excess solder ball seat from pouring

6, gently press the handle, pay attention to the ball

7, take the plant on the mold

8, check whether there is a ball or hold the ball. If there is corrected or off with forceps

9, the OK BGA with hot air gun uniform.


TAG:  BGA BGA balls BGA chip BGA flux
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