Copyright © 2014 www.lybga.com. All Rights Reserved. LiYang (LY) Welding Equipment Co., Ltd.
News
Contact
Industry News
Universal table of BGA heavy ball planting steps
Universal table of BGA heavy ball planting steps
Prepare tools: Universal planting bead stage, solder, solder paste, cleaning agent, flux, ceiling tin line,
oil painting brush, hexagon board hand, electric iron, cloth etc.
A.detinning
BGA is coated on a small amount of flux, with constant temperature soldering iron absorb solder ball,
and then temperature Luo iron heating suction line tin, tin absorption line to remove residual tin
BGA pad. (Note: the soldering temperature at 260 degrees to 300 degrees)
B.cleanout
Will be in addition to the BGA chip with a clean cloth dipped in clean cloth to wipe clean. (Note: BGA
flux on chemical reaction will occur and produce a qualitative change, influence of parts welding)
C.Ball planting process:
1, the BGA chip on the bead table, using the six corner plate to adjust the fixed base on the BGA size,
so that the BGA chip can be flat on the ground.
2, using the brush will help paste evenly coated on the BGA surface.
3, according to the different BGA chip select suitable reballing steel mesh and solder balls and steel
net fixed in planting beads and die, adjust steel mesh and chip tin point enable completely coincident)
4, pour into the solder ball planting Taiwan shaking the steel mesh, the corresponding solder fill
5, the excess solder ball seat from pouring
6, gently press the handle, pay attention to the ball
7, take the plant on the mold
8, check whether there is a ball or hold the ball. If there is corrected or off with forceps
9, the OK BGA with hot air gun uniform heating.
TAG:  BGA heavy ball planting