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What does BGA mean
What does BGA mean
Ball Grid Array foot Ball Array (packaging)
Is a large component pin package, QFP and four pin similar are by SMT solder paste welding connected
with the circuit board. The distinctness is listed in around the "one dimension" single row type pin, such
as gull wing shaped extension feet, flat feet, or retract the bottom of abdomen of J type foot and; change
into stomach bottom comprehensive array or the local array, for the distribution of two dimensional area
of solder ball of the foot, as chip package body on the circuit board solder interconnection tools. BGA
encapsulation method developed by Motorola Company in 1986, in advance is to BT organic sheet of
double-sided board (substrate), instead of the traditional metal tripod (lead frame for IC packaging. The
biggest advantage of BGA is that Pitch Lead is much more relaxed than QFP, and many QFP's foot distance
has shrunk to 12.5mil (Card 9.8mil), such as the P5 Daughter, which is the Solder CPU, which is used to
produce the PCB Super method. However, with the function of the BGA if the full array of CPU when the
end of a full array of square feet, the foot distance can be relaxed to 50 or 60mil, greatly easing the
technical difficulties of the upper and lower reaches.
At present, BGA can be divided into five categories,
(1) plastic carrier plate (BT) of the P-BGA
(with double and multi - layer), such domestic has begun to mass production.
(4)() TAB () is a slightly larger than the original chip m-BGA
(5) BGA D-Bga () Prolinx, M-BGA, V-BGA, etc.,
such as Kyocera (Dimpled), Olin, etc.. The latter is particularly worth mentioning, because their products
are first in the domestic production, and very difficult. Approach is to make the silver paste for
interconnection between layers of conductive material, increase oil production in the manufacture of
layer method (build up) V-BGA (Viper) and the carrier plate for two layer thickness of more than 10mil
copper acted as radiating layer, so do for high power (5 ~ 6W) large-scale IC packaging applications.
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