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BGA Station IR-PRO-SC V.5

LY IR-PRO-SC V.5 BGA Rework Station

LY IR-PRO-SC V.5 BGA Rework Station
LY IR-PRO-SC V.5 BGA Rework Station LY IR-PRO-SC V.5 LY IR-PRO-SC V.5 LY IR-PRO-SC V.5 LY IR-PRO-SC V.5
  • Heating Type : Infrared heating station
  • Model :LY IR-PRO-SC V.5
  • Voltage :220V AC
  • Rated Power :3000W
  • Weight : 30KG

Detailed

LY IR-PRO-SC V.5 BGA Rework Station

 

 

CE Certification
It can easily rework the variety of CPU's seat

 

 

Introduction
IR-PRO-SC V.5  Rework station for laptop motherboards, desktop computer motherboards, server boards,

industrial computer boards, all kinds of game boards, communications equipment motherboards, LCD

TVs and other large circuit board BGA rework.
IR-PRO-SC V.5 is Preheat independent infrared ceramic three-zone temperature control rework station,

easy to lead-free rework;

IR-PRO-SC V.5 have two top heating--IR and HR ,
If you like the IR , you can use the IR heating, IR is slow, but the motherboard Non-defrmation;
If you like the HR, you can use the HR heating, HR is fast for repair;
IR-PRO-SC V.5 upgrade to Usb port connect the computer;

 

Technical Parameters

 

Basic Parameters

Heating

IR and HR

Dimension

L480mmx W450mmx H500mm

Weight

30kg

Total weight

About 40 kg, vary with the differen need of the users

Electrical Parameters

Power

220V AC

Upper Heating

IR and HR

Size of upper (IR)

80*80mm

Consumption of upper (IR)

450W

Nozzle of upper(HR)

3 pcs: 25x25, 30x30, 45x45mm

Consumption of upper (HR)

800W

Bottom Heating

----------

Nozzle of bottom(HR)

----------

Consumption of bottom (HR)

----------

Bottom Preheat

IR

Consumption of preheat (IR)

2400W

General power

3KW

Temperature Control

Control mode of Upper

Independent temperature control, high-precision closed-loop
control, precision ± 0.5%, Alarm

Control mode of Bottom

Independent temperature control, high-precision closed-loop
control, precision ± 0.5%, NO Alarm

Rework Function

SMD

Suit for welding, remove or repair packaged devices
such as BGA,PBGA,CSP,multi-layer substrates, EMI
metallic shield product and solder/lead free Rework welding

Size of applicable chips

≤80mm x80 mm

Size of applicable PCB

≤415mm x325mm

 

Packing list:

 

1× bga rework station (with IR Top and Hot air Top with 3 pcs nozzles)

2× pcb bottom support

4× pcb jig (with screw)

2x Computer Cable

1x vacuum pen

1× power cord

1× k-type thermocouple

2× socket head wrench

1× CD of manual and software (if not get, may be lost in customs, please contact us)

 


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