LY HR7000 BGA Rework Station

Heating Type : Hot air station
Model :LY HR7000
Voltage :220V AC
Rated Power :2.3KW
Weight : 16KG

Detailed

CE Certification
It can easily rework the variety of CPU's seat

LY HR7000 BGA Rework Station

Introduction

HR7000 BGA Rework station for laptop motherboards, desktop computer motherboards, server boards, industrial computer boards, all kinds of game boards, communications equipment motherboards, LCD TVs and other large circuit board BGA rework.

HR7000 is Preheat independent infrared ceramic three-zone temperature control rework station, easy to lead-free rework;

Technical Parameters

Basic Parameters
Heating	HR
Dimension	L530mmx W385mmx H500mm
Weight	16kg
Total weight	About 20 kg, vary with the differen need of the users
Electrical Parameters
Power	220V AC
Upper Heating	HR
Size of upper (IR)	---------------
Consumption of upper (IR)	---------------
Nozzle of upper(HR)	5 pcs: 28x28, 35x35, 38x38, 43x43, 46x46 mm
Consumption of upper (HR)	650W
Bottom Heating	HR
Nozzle of bottom(HR)	2 pcs: 34x34, 44x44 mm
Consumption of bottom (HR)	650W
Bottom Preheat	IR
Consumption of preheat (IR)	700W
General power	2.3KW
Temperature Control
Control mode of Upper	Independent temperature control, high-precision closed-loop control, precision ± 0.5%, Alarm
Control mode of Bottom	Independent temperature control, high-precision closed-loop control, precision ± 0.5%, NO Alarm
Rework Function
SMD	Suit for welding, remove or repair packaged devices such as BGA,PBGA,CSP,multi-layer substrates, EMI metallic shield product and solder/lead free Rework welding
Size of applicable chips	≤80mm x80 mm
Size of applicable PCB	≤415mm x325mm