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E-mail: sales@lybga.cn

Tel: +86-755-82976821

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LY 5300 optical alignment system Mobile BGA rework station

2017 new LY 5300 auto optical alignment system Mobile BGA rework station 3 zones 2500W

Mobile rework video: https://youtu.be/cO5RII03_bU

Our BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc.

The main user is repairing shops and factory to provide the after-sales service and rework.

How to separate BGA chip from motherboard?

How to replace a new BGA chip?

Repair steps:

1) Separate the BGA chip from mother board –we called desoldering

2) Clean Pad

3) Reballing or replace a new BGA chip directly

4) Alignment/Positioning – Depend on experience ,silk frame ,optical camera

5) replace a new BGA chip - we called Soldering

Power supply AC 220V±10% 50/60Hz

3 Total power Max 2500W

4 Heater power Upper temp.zone 1200W,Down temp.zone 1200W

5 Electrical material Driving motor+ smart temp.controller+color touch screen

6 Temperature controlling (high precision K-sensor)(Closed Loop),independent temp.controller,the precision can reach ±1

7 Locating way V shape slot,PCB support jigs can adjust

8 PCB size Max 140×160mm Min 5×5 mm

9 Applicable chips Max 80×80mm Min 1×1 mm

10 Overall dimension L450×W470×H670mm

11 Temperature Interface 1 pcs

12 Weight of machine 40KG

13 Color Blue+White Mini BGA rework station

Nozzles : 4 top,1 bottom

Hits：【Printing】