BGA rework station for the safe use of standardized

3.1 boot, the left side of the machine "POWER" button to rotate to the "ON" position , then turn the machine power is turned on.

3.2 Remove the BGA operation 3.2.1 Click " enter the system " option, enter the machine's main screen

3.2.2 Click on the " Recipe Table of Contents" option to enter the program number , click on the " Open" option , enter the temperature editor .

3.2.3 confirm the temperature settings , click on the " download" - "OK " option, enter the temperature editor .

3.2.4 The PCB is fixed on the platform , adjust the position of the first zone and the second zone , making the PCB BGA Alignment

3.2.5 Click on the " start" button, the machine will automatically set the temperature curve in accordance run , run finished with a nozzle to suck BGA , remove the BGA chip.

3.3 BGA soldering operation

3.3.1 to remove the BGA and the PCB pads after the treatment , re- fixed on the PCB board platform , click the " Mount Vacuum On" option, BGA chip with a nozzle to suck .

3.3.2 shot out of the machine , adjust the brightness of the lights down , the operating point of view about a micrometer and moving , so that the chip BGA solder balls and PCB board pad alignment .

3.3.3 The nozzle manually fall, the BGA chip on the PCB pad , click the " Mount vacuum open " option.

3.3.4 Adjust the position of the first zone and the second zone , and it will be welded with BGA alignment, attention from the first zone and BGA maintained at 2-3 mm .

3.3.5 Click on the "Start " button , until the temperature curve has finished running , the BGA soldering operation is completed.

3.4 shutdown, the left side of the machine "POWER" button to rotate to the "OFF" position , turn off the machine power , the machine off !