Copyright © 2014 www.lybga.com. All Rights Reserved. LiYang (LY) Welding Equipment Co., Ltd.
BGA rework station for the safe use of standardized
3.1 boot, the left side of the machine "POWER" button to rotate to the "ON" position , then turn the machine power is turned on.
3.2 Remove the BGA operation 3.2.1 Click " enter the system " option, enter the machine's main screen
3.2.2 Click on the " Recipe Table of Contents" option to enter the program number , click on the " Open" option , enter the temperature editor .
3.2.3 confirm the temperature settings , click on the " download" - "OK " option, enter the temperature editor .
3.2.4 The PCB is fixed on the platform , adjust the position of the first zone and the second zone , making the PCB BGA Alignment
3.2.5 Click on the " start" button, the machine will automatically set the temperature curve in accordance run , run finished with a nozzle to suck BGA , remove the BGA chip.
3.3 BGA soldering operation
3.3.1 to remove the BGA and the PCB pads after the treatment , re- fixed on the PCB board platform , click the " Mount Vacuum On" option, BGA chip with a nozzle to suck .
3.3.2 shot out of the machine , adjust the brightness of the lights down , the operating point of view about a micrometer and moving , so that the chip BGA solder balls and PCB board pad alignment .
3.3.3 The nozzle manually fall, the BGA chip on the PCB pad , click the " Mount vacuum open " option.
3.3.4 Adjust the position of the first zone and the second zone , and it will be welded with BGA alignment, attention from the first zone and BGA maintained at 2-3 mm .
3.3.5 Click on the "Start " button , until the temperature curve has finished running , the BGA soldering operation is completed.
3.4 shutdown, the left side of the machine "POWER" button to rotate to the "OFF" position , turn off the machine power , the machine off !