Brief introduction of solder ball

Brief introduction of solder ball

The main function of solder balls is to connect semiconductor chips and lines with PCB boards, and to

send the electronic signals transmitted over the system. The sizes of solder balls used in IC assembly

field are from 0.15mm to 0.76mm. Generally, there are five categories of solder balls: General solder

balls (melting point is from 180℃~316℃); Low-temperature solder balls (including bismuth or indium,

melting point is from 95 ℃ ~ 135 ℃); High-temperature solder balls (melting point is from 95 ℃ ~ 135 ℃);

Fatigue resistance of high purity solder ball (melting point is from 178 ℃ to 183 ℃) and Lead-free solder

balls (lead composition is less than 0.1%)